assembly materials: sealants
Gun mounting foam
One-component, low-stress, semi-rigid pistol polyurethane based foam, containing environmentally friendly expansion gas.
Features:
- low pressure
- it is characterized by the correct machining time and initial efficiency
- it is distinguished by high density, low absorptivity, uniform structure and dimensional stability
- after application, it expands and cures under the influence of moisture contained in atmospheric air and building materials.
- it is a very good thermal, skimming and anti-moisture insulation
- after hardening, chemically neutral, opaque for a wide range of temperatures and development of fungi and mold
- good adhesion to concrete, plaster, building ceramics, wood, metals, PVC and similar plastics
- adhesive to horizontal and vertical surfaces – it does not drip
- ensures stability and flexibility of assembled elements
- does not contain (H) CFC, PCB and formaldehyde
- ensures precise dosing
- effective in use
| Specific weight after hardening | ISO 7390: 20-25 kg/m3 |
| Base | polyurethane |
| Capacity | 750 ml – from 30 to 40 liters * |
| Dust-free |
8-12 minutes* |
| Processing time | 30-60 minutes * |
| Curing time | up to 24 hours (full mechanical load) *
Free air access is necessary. Foam should not be used in tightly closed rooms. |
| Resistance to UV | weak
In external applications, the surface of the foam should be protected against UV radiation. |
| Cell structure | approx. 70% of aligned, evenly closed cells |
| Thermal resistance after hardening | from -40 ° C to + 90 ° C (short-term up to + 140 ° C) |
| Expansibility | up to 25% within 30-45 minutes after application * |
| Tensile strength | DIN 53456: 0,14 Mpa |
| Flexibility | DIN 53423: 0,28 Mpa |
| Shear strength | DIN 53422: 0,48 Mpa |
| Dimensional stability | -5% * |
| Insulation | 30 – 35 mW/mK |
| Flammability class | DIN 4102-1:B3 |
(*) – strong dependence on the ambient temperature, air humidity and substrate, temperature of the can, method of application, cross-section of the applied layer, wetting of the substrate, etc.
